The 2017 IEEE International RF and Microwave Conference (RFM C2017) is intended to provide an international forum on research progress and developments in electromagnetic wave theory, microwave, millimeter wave and THz technology, wireless communication technology and related fields. Seeking to promote mutual-interaction among participants, RFM 2017 will be held in Kuala Lumpur, Malaysia on November 13-15, 2017. RFM 2017 is organized by IEEE AP/MTT/EMC Joint Chapter, Malaysia, hosted by IEEE MTT-S, and technically co-sponsored by EuMA and IEEE AP-S.

All submissions will be peer reviewed by an international panel of reviewers. All accepted papers will be submitted to the IEEE Xplore Digital Library.

Call for papers

Authors are invited to submit full papers describing latest original research findings, in the areas of interest that include, but not limited to the following conference tracks:

Active Devices and Circuits
Signal generation, Low-noise and high power devices and circuits, Envelope tracking technologies, Pre-distorters, UHF and VHF technologies, Wide band-gap devices, Microwave tubes, rectennas, modulation and frequency control circuits, microwave photonics devices and systems, MMICs on GaAs, SiGe, GaN, RFICs, MMIC manufacturing, failure analysis, yield and cost, mm-wave, sub-millimetre wave and THz devices and circuits for applications including imaging and sensing.

Passive Components
Transmission line elements, Waveguides and striplines, Couplers and combiners, Innovative synthesis of multiband and broadband filters, Resonators, Non-planar passive filters and multiplexers, Active, tunable and integrated filters, Microwave acoustic devices – SAW, BAW FBAR devices, Thin film ferrite and ferroelectric devices, MEMS components and technologies, Optical components, Metamaterials, LTCC Devices.

Field, Device and Circuit Technologies
Device and circuit modeling including linear and non-linear device and structure modeling, Design optimization including EM, multi-physics and statistics-based modeling, Time- and frequency-domain techniques, Novel guiding structures for nanotechnology applications, Advanced material applications including RF nanotechnology, measurement and calibration methods of novel materials, carbon nanomaterial–based and devices.

Systems and Applications
Mobile and wireless communication systems – wireless system architecture, 4G/LTE/LTE-A/5G systems, WLAN/WiFi/WPAN/WBAN-DTV systems, High speed digital circuits and signal integrity, Mixed mode and digital signal processing circuits and systems, MIMO, SDR and cognitive systems, Broadcasting technologies, RFID systems and devices, mm-Wave communication systems, EMC and EMI, Wireless power transfer and energy harvesting. Packaging and interconnects – novel interconnect materials, advanced dielectrics and substrates, assembly methods, 3-D printing and interconnects. Biological effects and medical applications – EM field interaction with biological materials, microwave characterization of biological materials, RF instrumentation for healthcare, MRI and microwave imaging, non-destructive testing techniques.

Antennas and Propagation
Scattering and propagation, channel modeling, Planar antennas, mm-Wave/THz antennas, Broadband and multiband antennas, active, reconfigurable antennas, Antenna measurement and instrumentation. Radar, Remote sensing and Satellite communication systems and components.

Emerging Technologies and Applications
Wearable technologies for Internet of Things, wearable devices and systems, wearable computing, smart technologies. 3D RF and microwave components.

Important Dates

Full Paper Submission Deadline      :   Extended –> July 15, 2017
Notification of Acceptance                :    August 25, 2017
Early Bird Registration Deadline     :   September 22, 2016
Normal Registration Deadline          :   October 20, 2017
Final Manuscript Deadline                   :   October 20, 2017
Advance Program Delivery                :   November 1, 2017
Event Dates.                                               :   November 15 – 16, 2017

Paper Submission


Online Submission at: http://edas.info/N23526

All paper submissions should be written in English with a maximum paper length of FOUR (4) printed pages (10-point font) including figures without incurring additional page charges (maximum 1 additional page with over-length page charge if accepted). Papers exceeding 6 pages will not be accepted at EDAS. The accepted paper size is A4.

The submitted paper should be in pdf format of version 1.4 or above. Please ensure that all fonts are embedded in PDF file. Scanned (bit image) papers are not accepted. The pdf file should not contain bookmarks, form fields, links and annotations (notes).

Authors must not indicate their names and affiliations in the body of the paper to be submitted as a double-blind peer review process will be used to evaluate all papers.

All papers must be submitted online via EDAS at: http://edas.info/N23526

Authors are strongly encouraged to use the Standard IEEE conference templates to prepare the paper.


Online Submission at: http://edas.info/N23526


The IEEE reserves the right to exclude a paper from distribution after the conference (e.g., removal from IEEE Xplore®) if the paper is not presented at the conference UNLESS written permission to conference organizer (we provided alternative to present your paper).

Papers are reviewed on the basis that they do not contain plagiarized material and have not been submitted to any other conference at the same time (double submission). These matters are taken very seriously and the IEEE Malaysia Section  will take action against any author who has engaged in either practice.

IEEE Web Page on Plagiarism: http://www.ieee.org/web/publications/rights/Plagiarism_Guidelines_Intro.html

IEEE Web Page on Double Submission:http://www.ieee.org/web/publications/rights/Multi_Sub_Guidelines_Intro.html

PLEASE NOTE: To be published in the IEEE RFM 2015 Conference Proceedings and IEEE Xplore®, an author of an accepted paper is required to register for the conference at the FULL or LIMITED (member or non-member) rate and must present the paper at the conference. Non-refundable registration fees must be paid prior to uploading the final IEEE formatted, publication-ready version of the paper. For authors with multiple accepted papers, one paper one registration. Accepted papers will be published in the  IEEE RFM 2015 Conference Proceedings. Accepted and presented papers will be considered in the  IEEE RFM 2015 Conference Proceedings and in IEEE Xplore®.

Online Submission at: http://edas.info/N23526


General Chair
Zaiki Awang

General Co-Chair
Azremi Abdullah Al-Hadi

Technical Program Chair
Fauziahanim Che Seman

Technical Program Co-Chair
Mohd Khairul Mohd Salleh

Badrul Hisham Ahmad

Finance Chair
Mohd Haizal Jamaluddin

Publication Chair
Huda A Majid

Industrial Linkage
Azah Syafiah Mohd Marzuki
Muhammad Ramlee Kamarudin

Local Arrangement and Registration
Sharul Kamal Ab Rahim

RFM 2017 Secretariat

Microwave Research Institute
Faculty of Electrical Engineering
Universiti Teknologi MARA
40450 Shah Alam, Malaysia